Coating thickness measurement gauge for connectors XULM is available in various technical specifications. These are robust entry-level X-ray fluorescence measuring instruments for non-destructive material analysis and coating thickness measurement. Compact sized these devices are extensively acclaimed for their consistent performance, outstanding accuracy and longer service life. These are widely used for the non-destructive coating thickness measurement and material analysis.
Software Used : WinFTM®
Design Standards : DIN ISO 3497 and ASTM B 568
Measurements on very small flat components and structures on printed circuit boards in sizes up to 610 x 610 mm (24 x 24 in)
Analysis of very thin coatings, e.g., gold/palladium coatings of ≤ 0.1 μm (0.004 mils)
Automated measurements, e.g., in quality control
With 10 μm option: Measurements with smallest possible measurement spot in combination with a large silicon-drift-detector.
Intended use:Energy dispersive x-ray fluorescence measuring instrument (EDXRF) to
measure thin coatings and multi-layer systems on printed circuit boards and
components.
Element range:Aluminum Al (13) to Uranium U (92) – up to 24 elements simultaneously.
Application:Optimal measurement conditions for applications with Au and Pd due to the
specific excitation characteristics of the polycapillary optics.
For further information contact your FISCHER representative.
Design:Bench-top unit with hood opening upwards and housing with a slot on
the side.
X/Y- and Z-axis electrically driven and programmable
Motor-driven changeable filters
Measuring direction:Top down
X-ray tube:Standard: Micro focus tube with tungsten target and beryllium window
Optional: Micro focus tube with molybdenum target and beryllium window
High voltage:Three steps: 10 kV, 30 kV, 50 kV
Primary filter:4x changeable: Ni 10 μm (0.4 mils); free; Al 1000 μm (40 mils);
Al 500 μm (20 mils)
X-ray opticsPolycapillary
| X-Ray Source/Detection | |||
|---|---|---|---|
| Standard Non halo-free | Option 20 μm Halo-free | Option 10 μm Non halo-free | |
| Measurement spot, fwhm at Mo-Kα | appr. Ø 20 μm (0.8 mils) | appr. Ø 20 μm (0.8 mils) | appr. Ø 10 μm (0.4 mils) |
| X-ray detector | Peltier-cooled silicon-drift-detector (SDD) | Peltier-cooled silicon-drift-detector (SDD) | Peltier-cooled silicon-drift-detector (SDD) |
| Effective detector area | 20 mm2 (0.03 in2) | 50 mm2 (0.08 in2) | 50 mm2 (0.08 in2) |
For halo-free capillaries, the radiation intensity for all energies of the x-radiation is concentrated on the nominal measurement spot. For capillaries,indicated as non halofree,radiation intensity with high energies (E > 20 keV) can cover a significantly larger area than the nominal measurement spot.
Usable sample600 x 600 mm (23.6 x 23.6 in)
placement area
Width x depth:
Maximum travel:450 x 300 mm (17.7 x 11.8 in)
Max. travel speed XY:60 mm/s (2.4 in/s)
Repeatability precision XY:≤ 5 μm (0.2 mils), unidirectional
Max. sample weight:5 kg (11 lb)
Max. sample height:10 mm (0.4 in)
Video Microscope:High-resolution CCD color camera for optical monitoring of the
measurement location, manual focusing and auto-focus, with
contrast grid Crosshairs with a calibrated scale (ruler) and spot-
indicator,Adjustable LED illumination Laser pointer (class 1) to
support accurate specimen placement.
Zoom factor:Digital: 1x, 2x, 3x, 4x
Computer:Windows®-PC
Software:Standard: Fischer WinFTM® LIGHT
Optional: Fischer WinFTM® BASIC, PDM®, SUPER
Power supply:AC 115 V or AC 230 V 50 / 60 Hz
Power consumption:max. 120 W
Protection class:IP40
External dimensions:Width x depth x height [mm]: 670 x 885 x 660 mm (26.4 x 34.8 x25.9 in)
Weight:Approx. 156 kg (344 lb)
Operating temperature:10 °C – 40 °C / 50 °F – 104 °F
Storage/Transport0 °C – 50 °C / 32 °F – 122 °F
temperature:
Admissible air humidity:≤ 95 %, non-condensing
CE approval:EN 61010
X-Ray standards:DIN ISO 3497 and ASTM B 568
Approval:Individual acceptance inspection as a fully protected instrument according
to the German regulations „Deutsche Röntgenverordnung-RöV“.
PCB coating thickness measurement gauge - XULM PCB is engineered under the firm direction of experts. These are specific X-Ray fluorescence measuring instrument widely used for measurements and analyses of coating thicknesses and compositions on printed circuit boards. These are specific robust entry-level instrument, widely recommended by large numbers of clients.
Measurements on small components and structures on printed circuit boards in sizes up to 610 x 610 mm (24 x 24 in)
Measurements of functional coatings in the electronics and semiconductor industries
Determining of the composition of electroplating baths
Intended use: Energy dispersive X-ray fluorescence measuring instrument (EDXRF)
to determine thin coatings and alloys.
Element range: Chlorine (17) to Uranium U (92) – up to 24 elements simultaneously.
Design: Bench-top unit with housing with a slot on the side
Fixed sample support
Measuring direction: Bottom up
X-ray tube: Micro focus tungsten tube with beryllium window
High voltage: Three steps 10 kV, 30 kV, 50 kV
Aperture (Collimator): Ø 0.1 mm (optional Ø 0.2 mm, slot 0.3 mm x 0.05 mm)
Measurement spot: Depending on the measuring distance and on the aperture, the actual
measurement spot size is shown in the video image. Smallest measurement
approx. Ø 0.2 mm
X-ray detector: Proportional counter tube
Absorber: Optional cobalt or nickel absorber
Measurement distance: 0 … 27,5 mm (0 … 1.1 in) Distance compensation with patented DCM method
for simplified measurements at varying distances. For particular applications
or for higher demands on accuracy an additional calibration might be
necessary.
Video microscope:High-resolution CCD color camera for optical monitoring of the
measurement location along the primary beam axis, manual
focusing crosshairs with a calibrated scale (ruler) and spot-
indicator,adjustable LED illumination.
Zoom factor: Digital 1x, 2x, 3x, 4x
Usable sample Without extension : 800 x 630 mm (31.5 x 24.8 in)
placement area: Without extension : 800 x 630 mm (31.5 x 24.8 in)
Width x depth: With extension : 1200 x 630 mm (47.2 x 24.8 in)
Max. sample size: 610 x 610 mm (24 x 24 in) with extension
Width x depth:
Max. sample weight: 5 kg (11 lb)
Max. sample height: 90 mm (3.5 in)
Power supply: AC 115 V or AC 230 V 50 / 60 Hz
Power consumption: Max. 120 W
Protection class: IP40
External dimensions: Without extension : 800 x 800 x 560 mm (31.5 x 31.5 x 22 in)
Width x depth x height: With extension : 1200 x 800 x 560 mm (47.2 x 31.5 x 22 in)
Weight: Approx. 86 kg (190 lb)
Temperature: Operation 10 °C – 40 °C / 50 °F – 104 °F
Temperature 0 °C – 50 °C / 32 °F – 122 °F
Storage/Transport:
Admissible air humidity: ≤ 95 %, non-condensing
Computer: Windows®-PC
Software: Standard: Fischer WinFTM® BASIC including PDM®,
Optional: Fischer WinFTM® SUPER
CE approval: EN 61010
X-Ray standards:DIN ISO 3497 and ASTM B 568
Approval: Fully protected instrument with type approval according to the German
regulations "Deutsche Röntgenverordnung-RöV".
Coating thickness measurement for PCB using XDLM PCB 210 is a qualitative range of devices available in various technical specifications. These are extensively acknowledged as specific X-ray fluorescence measuring instruments for measurements and analyses of coating thicknesses and compositions on printed circuit boards. These are acclaimed for its longer service life and outstanding accuracy.
Software Used : WinFTM®
Design Standards : DIN ISO 3497 and ASTM B 568
Measurements on small components and structures on printed circuit boards in sizes up to 610 x 610 mm (24 x 24 in)
Measurements of functional coatings in the electronics and semiconductor industries
XDLM-PCB 210 and 220: Automated measurements, e.g., in quality control
Determining the composition of electroplating baths
Intended use:Energy dispersive x-ray fluorescence measuring instrument (EDXRF)
to determine thin coatings, small structures and alloys.
Element range:Chlorine (17) to Uranium U (92) – up to 24 elements simultaneously.
Design:Bench-top unit with housing with a slot on the side
Measuring direction:Top down
X-ray tube:
High voltage:Three steps: 30 kV, 40 kV, 50 kV
Aperture (Collimator):XDLM-PCB 200/210: Ø 0.1 mm (3.9 mils), optional Ø 0.2 mm (7.9 mils),
slot 0.3 x 0.05 mm (11.8 x 2 mils)
Standard (523-440): Ø 0.1 mm (3.9 mils); Ø 0.2 mm (7.9 mils); 0.05 x 0,05 mm
(2 x 2 mils); 0.2 x 0.03 mm (7.9 x 1.2 mils)
Optional (523-366): Ø 0.1 mm (3.9 mils); Ø 0.2 mm (7.9 mils); Ø 0.3 mm (11.8
mils); 0.3 x 0.05 mm (11.8 x 2 mils)
Measurement spot:Depending on the measuring distance and on the aperture, the actual
measurement.Spot size is shown in the video image.
Smallest measurement spot:approx. Ø 0.2 mm (7.9 mils)
Measurement distance:0 … 10 mm (0 … 0.4 in) Distance compensation with patented DCM for
simplified measurements at varying distances.For particular applications
or for higher demands on accuracy an additional calibration might be
necessary.
X-ray detector:Proportional counter tube
Sample positioning:Manually
Video microscope:High-resolution CCD color camera for optical monitoring of the
measurement location along the primary beam axis, Manual
focusing and auto-focus, Crosshairs with a calibrated scale
(ruler) and spot-indicator, Adjustable LED illumination,Laser
pointer (class 1) to support accurate,specimen placement.
Zoom factor:Digital 1x, 2x, 3x, 4x
Computer:Windows®-PC
Software:Standard: Fischer WinFTM® LIGHT
Optional: Fischer WinFTM® BASIC, PDM®, SUPER
| Dimensions | ||
|---|---|---|
| XDLM-PCB 200 | XDLM-PCB 210 | |
| External dimensions | 610 x 750 x 450 mm | With maximum XY travel range: 1000 x 1265 x 470 mm (39.4 x 49.8 x 18.5 in) |
| Width x depth x height | With extension: 1200 x 1050 x 450 mm (47.2 x 41.3 x 17.7 in) |
XY table retracted in home position: 650 x 810 x 470 mm (25.6 x 31.9 x 18.5 in) |
| Weight | Approx. 86 kg (190 lb) | Approx. 86 kg (190 lb) |
| Sample Stage | ||
|---|---|---|
| XDLM-PCB 200 | XDLM-PCB 210/220 | |
| Design | Fixed sample support with manual pop out function | Programmable XY-stage with pop out function |
| Usable sample placement area | 600 x 600 mm (23.6 x 23.6 in) With extension: 1200 x 900 mm (47.2 x 35.4 in) |
600 x 600 mm (23.6 x 23.6 in) |
| Maximum travel XY-axis | - | 450 x 300 mm (17.7 x 11.8 in) |
| Max. travel speed XY | - | 450 x 300 mm (17.7 x 11.8 in) 60 mm/s (2.4 in/s) |
| Repeatability precision XY | - | ≤ 0.01 mm (0.4 mils), unidirectional |
| Max. sample Weight | 5 kg (11 lb) | 5 kg (11 lb) |
| Max. sample Height | 5 mm | 5 mm |
Power supply:AC 115 V or AC 230 V 50 / 60 Hz
Power consumption:max. 120 W
Protection class:IP40
Operating temperature:10 °C – 40 °C / 50 °F – 104 °F
Storage/Transport0 °C – 50 °C / 32 °F – 122 °F
temperature:
Admissible air humidity:≤ 95 %, non-condensing
CE approval:EN 61010
X-Ray standards:DIN ISO 3497 and ASTM B 568
Approval:Fully protected instrument with type approval according to
theGerman regulations "Deutsche Röntgenverordnung-RöV".
“Hand-held instrument for measuring coating thickness on PC Boards and electroplated surfaces. The hand-held PHASCOPE® PMP10 is ideally suited for quality control in the electroplating and printed circuit board (PCB) industries. Because the instrument employs the phase-sensitive eddy current method (ISO 21 968), it allows the measurement of metal coatings on any substrate. A specially designed probe even enables measurements in PCB throughholes.”
Measuring copper thickness in PCB through-holes, especially on thick PC Boards.
Measuring coating thickness of nickel on steel
Measuring zinc or copper on steel – despite rough surfaces and complex surface geometries
Measuring the thickness of non-ferrous metals on non-ferrous metals, given sufficient difference in conductivity, e.g. copper on brass or bronze
Measuring the thickness of non-ferrous metals on insulating substrates, such as copper layers on circuit boards.
Sheet metal processing
Paint/zinc on iron, e.g. thin EPD coatings
Paint on aluminium
Paint on steel
Brake line tubing
Wire (mesh and lattice), e.g. shopping trolleys
Magnetic induction method For measuring the overall thickness of paint and
Amplitude-sensitive eddyFor measuring a single paint layer on aluminium
current method DIN EN
ISO 2360:
Phase-sensitive eddyFor measuring zinc coatings on iron,
current method ISOirrespective of overlying paint layers
21968:
DUPLEX measuring mode: display of paint on zinc on iron or paint on aluminium
DUAL measuring mode: display of total thickness (paint and zinc) on iron or paint on aluminium
Extensive evaluation and statistics functions
Outlier control and tolerance monitoring options
Various languages to choose from
Battery and/or continuous operation via plug-in charger (included)
Storage of up to 20,000 readings
Data transfer via RS232 interface
The CMS2 measures the thickness of virtually any metallic coating, including multi-layer, on any substrate material; it works according to the coulometric method by anodic dissolution (DIN EN ISO 2177). The simple handling and menu-supported operator guidance makes the CMS2 the ideal solution for both production monitoring in the electroplating industry and incoming inspection on finished parts.
The device comes equipped with nearly 100 predefined measuring applications for different coating systems (e.g. zinc on iron, nickel on brass), as well as various de-plating speeds (e.g. 1, 2, 5, and 10 μm/min). These can also be combined for measuring multi-layer systems.
The robust and user-friendly Couloscope CMS2 is suitable for both production monitoring in the electroplating industry and incoming inspection on finished parts.
Large, high-resolution colour display
Simple instrument operation and graphically supported user guidance
Partially-automated measurement with support stand V18 Simple selection of de-plating speed (0.1 – 50 μm/min) and de-plating area (0.6 – 3.2 mm Ø)
Graphic display of the voltage profile in the measuring cell
Graphic and statistical analysis options
Various languages and measurement units to choose from
Electroplated fasteners
Testing the remaining pure tin content on printed circuit boards
Chrome plated bathroom fittings
Common single and duplex coatings, such as ZN on iron or SN/NI on copper, can be measured
Accurate measurements of metal coating in the thickness range of 0.05 - 50 μm, no pre-settings are required for many materials; substrate composition and geometry are also irrelevant to the measuring process
Measurement of the remaining pure tin on printed circuit boards in order to ensure solderability
Multi-layer coatings such as CR/NI/CU on iron or plastic (abs) substrates
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